Pushing the Boundaries of Ultra-thinness.
Microprocessing by carbonic acid gas laser makes cutting to a plate thickness of 0.003mm a reality
Microprocessing is one of our strong points.
At Syohatsu, with the addition of personal skill, we have made processing to a plate thickness of 3 microns a possibility.
Precision parts processing is done in a speedy manner.
Example of processing via carbonic acid gas laser cutter
Benefits of microprocessing carbonic acid gas laser processors
With a high-quality beam adapted for microprocessing, it is possible to cut holes to a minimum of φ0.1mm, or plates to a minimum thickness of 0.003mm, and they are able to offer ultra-thin cutting, including base cutting processing for the semiconductor industry, resin sheet processing for the resin industry, shim processing for the precision machinery industry etc.